Recently, Jiangxi Province issued the "14th Five-Year Plan" Industrial Technology Innovation and Development Plan, by 2025, the province's industrial technology innovation ability in key areas of industry and information technology will be significantly improved.
The "Plan" pointed out that in terms of emerging industries, it will be guided by overcoming the core technology of the industry, focusing on building chains, strengthening chains, reinforcing chains, expanding chains, and extending chains, strengthening the integration of innovation chains and industrial chains, promoting the construction of innovation platforms and carriers, improving collaborative innovation models, promoting the sharing of innovation resources, and accelerating the transformation of innovation achievements. We will promote the leapfrog and high-quality development of strategic emerging industries such as aviation, electronic information, equipment manufacturing, traditional Chinese medicine and biomedicine, new energy, new materials, and next-generation information technology.
We will focus on key technologies in the fields of new photoelectric displays, printed circuit boards, electronic materials, smart sensors, industrial electronics, and intelligent identification, promote new breakthroughs in advantageous fields such as mobile intelligent terminals, photoelectric displays, semiconductor lighting, and smart homes, and promote the integrated development of "core screen end networks" in the electronic information industry. Among them, in the field of new displays, support the introduction of high-generation TFT-LCD panel production lines, focusing on the development of high-resolution, low-cost 6-14 inches of small and medium-sized display panels and 55 inches of large size LCD display panels.
Semiconductor lighting: Focus on the development of silicon substrate GAN-based LED epitaxy, chips and devices, expand downstream and supporting products and application technology, and enhance the industrial cluster based on silicon substrate LED manufacturing technology. Support MiniLED, MicroLED, long wavelength LED, deep UV LED and other new technology research and development, the development of semiconductor lighting downstream products and application technology.
Integrated circuit: With smart phones, smart TVS, wearable devices and other application chips as the entry point, enterprises and scientific research institutes are encouraged to increase investment in integrated circuit research and development, the introduction of advanced integrated circuit process production lines and industry leading enterprises, and the improvement of local chip design, manufacturing, sealing and testing capabilities.
New display: Support the introduction of next-generation TFT-LCD panel production lines, focusing on the development of high-resolution, low-cost 6-14 inches of small and medium-sized display panels and 55 inches of large size LCD display panels. Actively layout holographic display, laser display, quantum dot, MiniLED display, flexible display and other emerging technologies, focusing on breaking through the long life, high efficiency, high yield AMOLED panel production process, research and development of more than 8 generations of large size AMOLED panel production technology, research and development of foldable OLED display technology.
New electronic components and electronic materials: Develop GaN technology and gallium arsenide technology for LED, 5G radio frequency, power electronic devices and other fields; Relying on the existing electronic materials industry foundation, accelerate the development of rare earth luminous materials and magnetic materials, lithium battery materials, graphene materials, electronic copper foil, electronic glass fiber cloth and other products to accelerate the electronic materials industry to move towards the high-end.
Smart home: Layout smart TV LCD, OLED high-definition display screen manufacturing field, breakthrough organic material layer and glass substrate and other basic technologies. Break through the key technology of TWS headset industry chain, build microphone array series, cultivate intelligent acoustic industry chain, and focus on supporting the development of Blu-ray large-capacity CD, headset, speaker, audio and video cable and other supporting products.
Automotive electronics: Accelerate the large-scale application of automotive electronics in new energy vehicles, focusing on supporting the research and development of automotive electronic components such as vehicle touch control, vehicle voice system, and vehicle camera, developing key technologies such as new human-computer interaction, and improving and strengthening sensor products such as Lidar and millimeter-wave radar.
Printed circuit board (PCB) : Strive to break through the production process of high-end products such as IC carrier board and flexible PCB, and promote the development of advanced technologies such as component embedding technology and inkjet production technology. For the application of hot industries such as communications equipment, satellite communications, microwave transmission, etc., we will increase the proportion of high-end PCB products such as high-frequency multi-layer boards, flexible circuit boards, and high-density interconnect boards. Layout flame-retardant copper clad plate, ceramic substrate, high frequency microwave plate and thin electronic glass fiber cloth and other related supporting products.
Smart sensors and chips: Strengthen high-end sensor research and development, and deploy cutting-edge sensor technologies for the future. Guide the upgrading of smart sensor products, and continue to improve the application level of smart sensors in the industrial field. Strengthen the integrated application of iot chips with specific functions, and improve the technical application level of sensors and modules. Promote the design and production of system chips (embedded microprocessors) from specific segments such as chip design, manufacturing, sealing and testing, and enhance the diversified product supply capacity of chips.
